i ntegrated c ircuits d ivision www.ixysic.com ds-CPC1117N-r08 1 CPC1117N single-pole, normally closed 4-lead sop optomos ? relay e 3 pb part # description CPC1117N 4-lead sop (100/tube) CPC1117Ntr 4-lead sop (2000/reel) parameter rating units blocking voltage 60 v p load current 150 ma rms / ma dc on-resistance (max) 16 ? led current to operate 1 ma applications features description ordering information ? security ? passive infrared detectors (pir) ? data signalling ? sensor circuitry ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment?patient/equipment isolation ? aerospace ? industrial controls ? designed for use in security systems complying with en50130-4 ? only 1ma of led current required to operate ? 1500v rms input/output isolation ? small 4-lead sop package ? ttl/cmos compatible input ? no moving parts ? high reliability ? arc-free with no snubbing circuits ? no emi/rfi generation ? immune to radiated em fields ? smd pick & place, wave solderable ? tape & reel version available the CPC1117N is a miniature single-pole, normally closed (1-form-b) solid state relay in a 4-lead sop package that employs optically coupled mosfet technology to provide 1500v rms of input/output isolation. the efficient mosfet switches and photovoltaic die use ixys integrated circuits division?s patented optomos architecture. the optically coupled output is controlled by the input's highly efficient gaalas infrared led. ixys integrated circuits division?s state of the art double-molded vertical construction packaging makes the CPC1117N one of the world?s smallest relays. it offers board space savings of at least 20% over the competitor?s larger 4-lead sop relay. approvals ? ul recognized component: file e76270 ? csa certified component: certificate 1175739 ? en/iec 60950-1 certified component: tuv certificate b 10 05 49410 006 form-b i f 10% 90% i load t on t off pin configuration switching characteristics of normally closed devices 1 2 3 4 + control C control load load free datasheet http:///
i ntegrated c ircuits d ivision www.ixysic.com 2 r08 CPC1117N absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. absolute maximum ratings @ 25oc parameter ratings units blocking voltage 60 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power disipation 70 mw total power dissipation 1 400 mw isolation voltage, input to output 1500 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 3.33 mw / oc parameter conditions symbol min typ max units output characteristics load current continuous 1 i f =0ma i l - - 150 ma rms / ma dc peak t=10ms i lpk - - 350 ma p on-resistance 2 i f =0ma, i l =120ma r on -516 ? off-state leakage current i f =1ma, v l =60v p i leak --1 a switching speeds turn-on i f =2ma, v l =10v t on - 0.316 10 ms turn-off t off - 1.55 10 output capacitance i f =1ma, v l =50v, f=1mhz c out -10- pf input characteristics input control current to activate (output open) 3 -i f - 0.16 1 ma input control current to deactivate (output closed) i l =120ma i f 0.1 0.14 - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r - - 10 a common characteristics capacitance input to output - - - 1 - pf 1 load current derates linearly from 150ma @ 25 o c to 100ma @85 o c. 2 measurement taken within 1 second of on-time. 3 for applications requiring high temperature operation (greater than 60 o c) a led drive current of 3ma is recommended. electrical characteristics @ 25oc free datasheet http:///
i ntegrated c ircuits d ivision CPC1117N www.ixysic.com 3 r08 performance data* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. 35 30 25 20 15 10 5 0 1.17 1.19 1.21 1.23 1.25 led forward voltage drop (v) device count (n) typical led forward voltage drop (n=50, i f =5ma, t a =25oc) turn-on time (ms) 0.28 0.30 0.32 0.34 0.36 0.38 device count (n) 0 5 10 15 20 25 typical turn-on time (n=50, i f =2ma, i l =100ma, t a =25oc) turn-off time (ms) 1.15 1.30 1.45 1.60 1.75 1.90 2.05 device count (n) 0 5 10 15 20 typical turn-off time (n=50, i f =2ma, i l =100ma, t a =25oc) led current (ma) 0.11 0.13 0.15 0.17 0.19 0.21 0.23 device count (n) 0 5 10 15 20 typical i f for switch operation (n=50, i l =150ma, t a =25oc) 35 30 25 20 15 10 5 0 5.0 5.2 5.4 5.6 5.1 5.3 5.5 device count (n) typical on-resistance distribution (n=50, i l =150ma, t a =25oc) on-resistance ( : ) 35 30 25 20 15 10 5 0 85 95 105 115 90 100 110 blocking voltage (v p ) device count (n) typical blocking voltage distribution (n=50, i f =1ma, t a =25oc) temperature (oc) -40 -20 0 20 40 60 80 100 led forward voltage (v) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 typical led forward voltage drop vs. temperature i f =5ma i f =2ma i f =1ma i f =50ma i f =20ma i f =10ma led current (ma) 0 1020304050 turn-on time (ms) 0.25 0.26 0.27 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 typical turn-on time vs. led forward current (i l =100ma, t a =25oc) led current (ma) 0 1020304050 turn-off time (ms) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 typical turn-off time vs. led forward current (i l =100ma, t a =25oc) temperature (oc) -40 -20 0 20 40 60 80 100 led current (ma) 0.10 0.15 0.20 0.25 0.30 typical i f for switch operation vs. temperature (i l =100ma) temperature (oc) -40 -20 0 20 40 60 80 100 turn-on time (ms) 0.20 0.25 0.30 0.35 0.40 0.45 typical turn-on time vs. temperature (i l =100ma) i f =10ma i f =5ma i f =2ma i f =1ma temperature (oc) -40 -20 0 20 40 60 80 100 turn-off time (ms) 0 1 2 3 4 5 typical turn-off time vs. temperature (i l =100ma) i f =1ma i f =2ma i f =5ma i f =10ma free datasheet http:///
i ntegrated c ircuits d ivision www.ixysic.com 4 r08 CPC1117N performance data* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. -40 8 7 6 5 4 3 2 -20 0 20 40 60 80 100 typical on-resistance vs. temperature (i f =0ma, i l =150ma) temperature (oc) on-resistance ( : ) load voltage (v) load current (ma) 150 100 50 0 -50 -100 -150 -1.00 -0.66 -0.33 0 0.33 0.66 1.00 typical load current vs. load voltage (t a =25oc) 225 200 175 150 125 100 75 50 25 0 temperature (oc) load current (ma) -40 -20 0 20 40 60 80 120 100 maximum load current vs. temperature (i f =0ma) blocking voltage (v p ) -40 125 120 115 110 105 100 95 90 -20 0 20 40 60 80 100 temperature (oc) typical blocking voltage vs. temperature (i f =2ma) leakage (a) -40 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -20 0 20 40 60 80 100 temperature (oc) typical leakage vs. temperature measured across pins 3&4 (i f =2ma, v l =60v) load voltage(v) 0 102030405060 output capacitance (pf) 5 10 15 20 25 30 35 40 output capacitance vs. load voltage (i f =1ma, f=1mhz, t a =25oc) time load current (a) 10s 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1ms 100s 100ms 1s 10ms 10s 100s energy rating curve free datasheet http:///
i ntegrated c ircuits d ivision CPC1117N www.ixysic.com 5 r08 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating CPC1117N msl 3 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time CPC1117N 260oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb free datasheet http:///
i ntegrated c ircuits d ivision ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-CPC1117N-r08 ?copyright 2012, ixys integrated circuits division optomos? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/14/2012 for additional information please visit our website at: www.ixysic.com 6 CPC1117N mechanical dimensions CPC1117N CPC1117Ntr tape & reel recommended pcb land pattern 2.54 (0.10) 5.60 (0.2205) 1.30 (0.0512) 0.60 (0.0217) dimensions mm (inches) pin 1 4.089 0.203 (0.161 0.008) 2.54 typ (0.100 typ) 6.096 0.102 (0.240 0.004) 3.810 0.076 (0.150 0.003) 0.432 0.127 (0.017 0.005) 0.200 0.025 (0.008 0.001) 1.02 0.025 (0.040 0.001) 2.184 max (0.086 max) 0.381 typ. (0.015 typ.) lead to package standoff: 0.0637 0.0383 (0.0025 0.0015) 0.762 0.102 (0.030 0.004) dimensions mm (inches) note: all dimensional tolerances per standard eia-481-2 except as noted embossment embossed carrier 330.2 dia (13.00 dia) top cover tape thickness 0.102 max (0.004 max) u ser direction of feed user direction of feed k 0 =2.70 (0.106) k 1 =2.30 (0.091) b 0 =4.70 (0.185) w=12.00 (0.472) p=8.00 (0.315) a 0 =6.50 (0.256) free datasheet http:///
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